Abstract
To enhance the power density of LLC resonant converters, multilayer planar inductors are required. However, multilayer planar inductors have high parasitic capacitance, which may cause inductor current ringing in LLC resonant converters, leading to EMI problems. In this paper, it is found that by using interleaved winding inductors, compared with traditional winding inductors, the parasitic capacitance of multilayer planar inductors is reduced, which can reduce current ringing, without sacrificing power density and increasing manufacturing complexity. The method used to analyze current ringing is to establish an impedance model, and the parasitic capacitance of the interleaved winding inductors is verified by FEM simulations. The analysis is validated in an LLC resonant converter prototype.
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