Abstract
A compact planar meander-bridge high impedance electromagnetic structure (MBHIES) was designed and its bandgap characteristics, mutual coupling reduction abilities were studied and compared in detail. Several parametric analyses were performed to obtain optimized design values and the transmission responses were calculated through the suspended microstrip line and waveguide simulation methods. The achieved bandgap is 2.3 GHz (2.55–4.85 GHz) with −61 dB minimum transmission coefficient level at the center frequency of 3.6 GHz. To see the effectiveness, the proposed design was inserted between a microstrip patch antenna array which operates at 3.8 GHz and whose operating bandwidth falls within the MBHIES bandgap. The surface wave suppression phenomenon was analyzed and simulated results are verified by measuring the fabricated prototypes, both are in good agreement. The configuration reduced the mutual coupling by 20.69 dB in simulation and 19.18 dB in measurement, without affecting the radiation characteristics of the array but increasing the gain slightly.
Highlights
The demand for compact and high performance devices for versatile applications is boosted with the rapid advancement of the wireless technology
Integration high impedance electromagnetic surfaces (HIES)/electromagnetic bandgap structures (EBG) structures in a microstrip antenna array are quite attractive for their ability to suppress surface waves and reduce the mutual coupling effects
This work presents a compact design of vialess planar meander-bridge high impedance electromagnetic structure (MBHIES) with wide bandgap and deeper rejection levels
Summary
The demand for compact and high performance devices for versatile applications is boosted with the rapid advancement of the wireless technology. Integration HIES/EBG structures in a microstrip antenna array are quite attractive for their ability to suppress surface waves and reduce the mutual coupling effects. These high impedance surfaces are realized with the periodic arrangement of dielectric or metallic elements. Many different high impedance structures have been designed based on the mushroom-like configuration described in [1], and applied to reduce mutual coupling of antenna array [3,14,15]. This study proposes a uniplanar compact design of vialess high impedance electromagnetic structure (HIES) with smaller size unit cell. The designs are inserted between a two element microstrip antenna array that operates at 3.8 GHz and coupling reduction abilities are verified by comparing the simulated and measured results
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