Abstract
The objective of the present study is to evaluate the impact of electronic packaging design/manufacturing process parameters on the thermal fatigue life of ball grid array (BGA) solder joints. The four selected parameters are BGA under-fill materials, conformal coating, solder pad sizes on printed wiring board, and BGA rework, with each having either two or three levels of variation. A test vehicle (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed and fabricated, and then subjected to temperature cycling (−55°C to +125°C) with continuous monitoring of solder joint integrity. The total of 15 experimental cases is used in the present study. Based on monitored results, a destructive physical analysis is conducted to further isolate the failure locations and determine the failure mechanisms of the solder joints. Test results indicate that the influence of these design parameters on fatigue life is dependent on the particular package, in some instances improving the fatigue life tenfold.
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