Abstract

As a relevant communication structure for integrated circuits, Network-on-Chip (NoC) architecture has attracted a range of research topics. Compared to conventional bus technology, NoC provides higher scalability and enhances the system performance for future System-on-Chip (SoC). Divergently, we presented the packet-switching router design for 2D NoC which supports 2D mesh topology. Despite the offered benefits compared to conventional bus technology, NoC architecture faces some limitations such as high cost communication, high power consumption and inefficient router pipeline usage. One of the proposed solutions is 3D design. In this context, we suggest router architecture for 3D mesh NoC, a natural extension of our prior 2D router design. The proposal uses the wormhole switching and employs the turn mod negative-first routing algorithm Thus, deadlocks are avoided and dynamic arbiter are implemented to deal with the Quality of Service (QoS) expected by the network. We also adduce an optimization technique for the router pipeline stages. We prototyped the proposal on FPGA and synthesized under Synopsys tool using the 28 nm technology. Results are delivered and compared with other famous works in terms of maximal clock frequency, area, power consumption and estimated peak performance.

Highlights

  • During the last decade, the evolution of technology has shrunk the dimension of transistor and made possible its integration of billions on the same chip

  • Bringing together 2D Network on Chip (NoC) architecture with 3D IC technology, makes the design of 3D NoC possible which is a stack multiple die in the vertical axis that are interconnected through silicon via (TSV) [6]

  • We adduced the router design for 3D mesh NoC topology which establishes an extension of our former work

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Summary

Introduction

The evolution of technology has shrunk the dimension of transistor and made possible its integration of billions on the same chip This increasing number of transistor densities allows the integration of countless cores on a single chip. It requires a powerful on-chip interconnection scheme to satisfy the communication between the large numbers of cores on chip [1]. They render the integration of hundreds of cores on a planner chip not satisfying for future applications. The latter are getting more complex demanding a higher performance system to handle parallel computing and provide higher bandwidth. 3D NoC satisfies the on-chip communication requirements for future MPSoC

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