Design of co-planar waveguide-fed slot/patch antenna with wire bond for a 60-GHz complementary metal-oxide-semiconductor transceiver

Abstract

In this study, an antenna design technique that includes wire bond interconnection for 60-GHz antenna–chip integration is investigated. The presented technique is unique as it does not require additional matching elements to deal with wire bond interconnection effects on the antenna input impedance matching bandwidth. As the reactance of the bonding wires is compensated by design of the antenna circuit, the matching bandwidth is not significantly reduced. To the authors’ knowledge, this is the first antenna design presented for integration with a 60-GHz CMOS chip using wire bond interconnection without a compensation network.