Abstract
A two-phase loop thermosyphon system is developed for the B-ISDN telecommunications system and its performance is evaluated both experimentally and by visualization techniques. The design of the thermosyphon system proposed is aimed to cool muliichip modules (VICM) upto heat flux of 8 W/cm 2 . The results indicate that in the loop thermosyphon system, cooling heat flux is capable of 12 W/cm 2 with two condensers under the forced convection cooling of the condenser section with acetone or FC-87 as the working fluid. The instability of the working fluid flow within the loop is observed using the visualization techniques and temperature fluctuation is stabilized with orifice insertion.
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