Abstract
A single-layer ±45° dual-polarized directional array antenna for millimeter wave (mm-wave) applications is designed in this communication. Based on the theory of orthogonal circularly polarized (CP) wave multiplexing, two ports of a series-fed dual CP array are fed with equal amplitudes, and the array can radiate a linearly polarized wave with ±45° polarization orientations through the adjustment of the feeding phase difference. As the two ports of the series-fed array are simultaneously excited, the antenna can achieve directional radiation. In addition, the cross-polarization level of the array can be effectively suppressed by placing two series-fed arrays side by side. A prototype of the designed array antenna operating at 30 GHz is fabricated and measured; the working bandwidth of the proposed antenna is approximately 3.5%. Owing to its simple structure and directional radiation, the proposed antenna array is a competitive candidate for mm-wave applications.
Highlights
Accepted: 21 June 2021Millimeter wave technology has many attractive application scenarios, such as gesture radars, automotive radars, imaging sensors, and the rapidly developing fifth-generation mobile communication system [1,2,3,4]
The antenna array is an important part of the mm-wave system, and the balance between its performance, cost, size, and integration difficulty has an important impact on the further promotion of mm-wave applications
The mm-wave antenna printed on a single-layer substrate is an extremely competitive candidate due to its huge advantages in integration difficulty and cost
Summary
Accepted: 21 June 2021Millimeter wave (mm-wave) technology has many attractive application scenarios, such as gesture radars, automotive radars, imaging sensors, and the rapidly developing fifth-generation mobile communication system [1,2,3,4]. The antenna array is an important part of the mm-wave system, and the balance between its performance, cost, size, and integration difficulty has an important impact on the further promotion of mm-wave applications. The mm-wave antenna printed on a single-layer substrate is an extremely competitive candidate due to its huge advantages in integration difficulty and cost. The key challenge in mm-wave antenna-in-package (AiP) technology is how to minimize the interconnect loss between the die and antenna [5]. For the single-layer antenna, the antenna array, feeding network, and die can be printed on a layer substrate to reduce the interconnect loss. Even in some AiP packaging technology, only one layer of copper can be used to design antennas, such as the embedded wafer-level ball grid array (eWLB)
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