Abstract
This paper introduces a 16 channel Ku-band tile T/R module design in 3D highly integrated packaging. The technical indicator design of T/R module is completed by using four channel amplitude phase multifunctional chip and various design methods. Through reasonable indicator distribution and structure layout, the miniaturization design of T/R module is realized by using high-density substrate and 3D interconnection structure. Through process optimization, structural design and simulation verification, the reliability and producibility of T/R module is studied, and the consistency of products is improved. The test results show that the design has good microwave performance and can meet the requirements of high performance, low cost and batch production of Ku-band T/R module.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
