Abstract
Design of a GaN-Based Flip Chip Light Emitting Diode (FC-LED) with au Bumps & Thermal Analysis with Different Sizes and Adhesive Materials for Performance Considerations
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
