Abstract
A Miniaturization and Isolation CAN Bus communication system circuit based on 3D package is presented in this paper. This circuit brings the advanced stacked 3D package technology to makes the CAN BUS Controller, Isolator, CAN BUS Transceiver, Crystal Oscillator, Power Management and so on to bury in three PCB board, and forms the SIP package of 15mm*15mm*4mm. Compared with the general devices on the market, the circuit volume is reduced by 2/3.
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