Design of a 3D Wilkinson power divider using through glass via technology * * Projected supported by the National Natural Science Foundation of China (Nos. 61771268, 61571248, U1709218), the Science and Technology Fund of Zhejiang Province (No. 2015C31090), the Natural Science Foundation of Zhejiang (No. LY17F040002), and the K. C. Wong Magna Fund in Ningbo University.

Abstract

Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this study, through glass vias (TGVs) are used to implement 3-D inductors for minimal footprint and large quality factor. Using the inductors and parallel plate capacitors, a compact 3-D Wilkinson power divider is designed and analyzed. Compared with some reported power dividers, the proposed TGV-based circuit has an ultra-compact size and excellent electrical performance.