Design of a 108 Pin VLSI Package With Low Thermal Resistance

Kanji Otsuka,Tamotsu Usami

doi:10.1155/apec.10.311

Abstract

The design of a 108 pin VLSI package is described. The package has low thermal resistance and can, therefore, dissipate 4 watts of power. The package design is now being used commercially in high-end computers made by Hitachi.

Highlights

The increasing circuit/gate density of LSI chips presents a variety of challenges to packaging technology
The package design is being used commercially in high-end computers made by Hitachi
The requirement for this package design is, stated: A 550 gate ECL logic VLSI with 4W of power must be mounted in a single package to effect maximum performance

Summary

INTRODUCTION

The increasing circuit/gate density of LSI chips presents a variety of challenges to packaging technology. The package must absorb an increasing amount of power and an ever growing number of interconnections. Packaging engineers have discussed a number of different packages, but there is no simple formula to determine the most cost effective and reliable combination of package types. One such approach has developed a package for the ECL VLSI, which has 550 gates, 4W of power and 108 pins

PACKAGE DESIGN

THERMAL RESISTANCE

DESIGN OF THE PACKAGE STRUCTURE

CONCLUSION