Abstract
Design of a multispectral infrared focal plane array ROIC (readout integrated circuit) with TDI (time delay integration) is presented. A 3 SNR improvement can be achieved by a 3 pixels TDI implementation. The 3 pixel signals in each channel are firstly integrated by 3 CTIA structures, then the TDI action is in SC-AMP (switch capacitor amplifier) of each channel. A novel switch capacitor amplifier topology is proposed which can both reduce power dissipation by shutting down the AMP and realize offset voltage cancellation. Besides, bad pixel replacement is realized by an alternative gain of the SC-AMP. The proposed ROIC can work well both room and cryogenic temperature. Simulation results show that the CTIA input stage have a good linearity of 99.721% (post-layout sim) over 2.8V output span.
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