Abstract
The design, manufacturing, analysis, and measurement of a thermal and electrical enhanced cavity-down plastic ball grid array (PBGA) package are presented in this study. Because of the split via connection (SVC) design, the package consists of a very-thin single core of organic material and two-metal layers of copper and is manufactured with the conventional printed circuit board (PCB) process at very low cost. Furthermore, the heat spreader is made with bottom surface having saw-teeth to contact the ground planes disposed on the backside of the substrate. Improvements in electrical and thermal performance are achieved. Parasitic parameters of the package are extracted from time domain reflectometer (TDR) measurements. The thermal performances of the packages are studied by both 3D finite element analysis and wind-tunnel measurements. The results are compared with other well-known packages.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
