Abstract
LED performance was significantly improved because of the improvement of encapsulation design and materials properties. The design key points were reviewed in point view of optical, electrical, thermal, and reliability consideration. It was concluded that the packaging design should be simultaneously implemented with the chip design, integrally considering the optics, electrics, thermal, and reliability together. The interfacial thermal resistance and stress from packaging also play critical roles for the optical efficiency and reliability of packaged LED device.
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