Abstract

Based on the trends in development of integrated circuits (IC) until the year 2000 it is shown that, presuming the present capability of electron beam test systems, in future an electron beam test (EBT) will not be practicable anymore. This is mainly due to long measurement times, large measurement errors at passivated IC and the restricted test access. Of course, the performance of EBT may be improved significantly by improved equipment in order to meet the requirements given by the IC development as will be pointed out in this work. However, the physical limitations can already be foreseen. Therefore alternatively to the improvements of equipment a design for e-beam testability (DFEBT) has to be realized. Measures for a DFEBT will be discussed.

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