Abstract
Due to the rapid expansion of the electronics sector, e-waste is becoming a growing issue that requires immediate attention. In particular, the complex assemblies and miniaturisation of these devices makes it difficult to recycle them properly. Additive manufacturing (AM), also known as 3D printing, offers a potential solution to this problem. The ability to print structures in μm- range makes it possible to print and manufacture electronic components in such a way that predetermined breaking points can be incorporated. Parts printed in this way are subject to the concept of Design for Disassembly, which describes the production of multi-material compounds or composites that can be easily separated or recycled. Using a multi-material approach in combination with Thermally Expandable Microspheres (TEMs) and processed by 3D printing, we produced easily separable compounds on demand. The compounds were characterized regarding their (thermo)mechanical behaviour. The study investigated the influence of the printed separation layer on the mechanical properties of the overall compound for various layer orientations. The printed parts were separated using heat as an external impulse, without requiring extensive force. This was achieved by subjecting the parts to a temperature of 200 °C for 10 minutes in a conventional oven.
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