Design, fabrication, and testing of a water-cooled tungsten-foam high-heat flux plasma-facing module

Abstract

We present a comprehensive study detailing the design, fabrication and testing a new modular “finger” component, featuring a hexagonal tungsten foam armor tile bonded to the top surface of the water-cooled finger unit. The mechanical, thermal, and particle transport properties of the tungsten foam armor were determined for a wide range of porosity and cell size, and then combined in an equivalent solid material with “effective” properties suitable for large-scale simulations. A series of 3-D multiphysics simulations for coupled thermal and mechanical behavior of the “finger” module are used to optimize the design before fabrication. The simulation results show that, for the expected experimental conditions, a safe range of heat flux and foam porosity is possible for both water-cooling and helium-cooling. Based on these multiphysics simulations, an optimum finger cooling module has been fabricated at Ultramet, Inc. A series of experiments were designed to study the thermomechanical performance of the “finger” unit under steady-state and transient thermal loading at surface heat flux up to 16 MW/m2 in the High Energy Flux Test facility (HEFTY) at UCLA. Testing conditions included low-power, steady-state plasma exposure at 6 MW/m2, followed by severe high heat flux cycles at 16 MW/m2. Results of these tests are explained through comparisons with multiphysics simulations. To eliminate the effects of thermomechanical damage carried out on a module on its thermo-mechanical response on a subsequent test, three different yet identically designed and fabricated finger modules were tested. The results show that the current design is capable of cooling the walls of fusion devices at surface heat flux up to 6 MW/m2 without failure, and that the failure heat flux limit is below 16 MW/m2.