Abstract
Embedded passives technologies can provide benefits of size, performance, cost, and reliability to high density, high‐speed designs. A number of embedded passive technology solutions are available to the designer. Based on our experience with Rohm and Haas's thin‐film, high‐ohmic, InSiteTM embedded resistor materials (500 and 1000 Ω/sq), this paper provides some guidelines for selecting the appropriate embedded resistor technology and implementing it at a board fabricator. The design of embedded resistors, and the trade‐offs between resistor size, tolerance, and capability of board fabrication processes, are analyzed in detail. This paper also discusses selection of the appropriate embedded capacitor technology and introduces some initial results on Rohm and Haas's thin‐film, high‐Dk, InSite embedded capacitor material (200 nF/cm2).
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