Abstract
In this chapter, we present the design challenges that are faced in a wireless sensor system to be placed in between the orthodontic braces and tooth. Such wireless systems are necessary, to indicate the bond failure between the braces and tooth, for the patient and the orthodontist as it saves both time and money. A humidity sensor-based implanted chip is selected for such purpose that will detect humidity leak once the bond breaks with power being supplied to it through inductive coupling with internal coil integrated in the chip and external coil placed in an external unit. It has shown how extensive study must be carried out in developing such a system especially with power transfer in such an environment factoring changing impedances due to mouth mechanics and movement dynamics. It also presents how data acquisition and transfer can take place in such a system. The chip has been designed using 180nm CMOS GLOBALFOUNDRIES process.
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