Abstract

Moderate to severe hearing loss is a debilitating condition that affects over 5% of the world’s population. Hearing aids and cochlear implants positively impact the lives of those who suffer from sensorineural hearing loss. However, both display numerous limitations that affect their adoption and use rates, notably including those associated with the external elements of these devices (e.g., microphone and signal processor). These external components impact device safety, appearance, acoustic performance, and ease-of-use. A totally implantable auditory prosthesis would help to address these issues by eliminating external components. A major barrier to progress toward this goal is the lack of a completely implantable acoustic sensor capable of matching or exceeding the performance of commercial external microphones. Our previous studies have indicated that piezoelectric microelectromechanical systems (MEMS) accelerometers have the potential to function as implantable sensors within the middle ear meeting a 20-phon noise floor over a 100–8 kHz range. In this paper, we describe a process to design and fabricate dual and tri-resonance devices that are comprised of piezoelectric cantilever bimorph beams tip-loaded by a proof mass, can meet or exceed the 20-phon noise floor, and can produce a measurable voltage output when deflected by sound-induced ossicular vibrations.

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