Design and testing of novel piezoceramic modules for adaptive thermoplastic compositestructures

Abstract

For the series production of adaptive fibre-reinforced thermoplastic structures, thedevelopment of process-adapted piezoceramic modules is gaining central importance.Therefore, thermoplastic-compatible piezoceramic modules (TPMs) are being developedwhich are suitable for a matrix-homogeneous adhesive-free integration of the modules infibre-reinforced thermoplastic structures during a sequential hot-pressing process.Extensive numerical and experimental studies are available on the systematicdevelopment of the TPMs, whose thermoplastic carrier film, made, respectively, ofpolyetheretherketone (PEEK) or polyamide (PA), is already adapted to the matrixmaterial of a thermoplastic composite structure and thus can be joined in a welding processwithout additional adhesives. The studies carried out indicate the influence of geometricaland technological parameters on the efficiency of consolidated and polarized TPMs and canthus be used to adapt the design specifications and process parameters of theTPMs. Besides these studies, a numerically based residual stress analysis shows thepotential for a defined inducing of residual stresses in the TPM components.