Abstract

With the rapid development of 5G technology, low dielectric constant materials present a widespread application prospect in microelectronic devices. Poly (aryl ether) resins have been widely used in this field due to their excellent thermal stability, mechanical properties and electrical insulation properties, however, reducing its dielectric constant remains a challenge. In this study, novel phenolphthalein poly (aryl ether ketone) containing isopropyl groups and fluorene groups was successfully synthesized with high molecular weight via SN2 aromatic nucleophilic polycondensation reaction. At lower frequencies ranging from 10 Hz to 1 MHz and higher frequencies from 10 GHz to 42 GHz, the films exhibit the intrinsic dielectric constant in the range of 2.4–2.7. The resin has good thermal stability, mechanical properties and insulation properties. Thus, the functional poly (aryl ether ketone) possesses attractive potential applications in the field of high-performance flexible electronic packaging materials.

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