Abstract
It is difficult to cool high thermal flux electronics by traditional methods such as air cooling, common liquid cooling and so on. However, vapor compressor refrigeration system is an efficient approach to solve this problem. Heat sink is important equipment in system, so the goal of this paper is to design a heat sink which is similar to an evaporator in vapor compression system with head load 100W. Mathematical model of heat sink is set up. Different heat flux, pressure drop, heat transfer area and weight with different micro-channel width are obtained finally.
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