Abstract
Molded interconnect device (MID) technology is a key enabling technology with growing markets in automotive, communications, consumer electronics through integration with lighting and sensor technologies. The MID technology is yet to be explored for high temperature applications in automotive or consumer lighting. One of the hindering factors for such implementation in the serial production and time to market is the improper electronic and thermal packaging of the light emitting diodes (LEDs) on the MID substrates. This paper addresses the optimization of mold design, surface metallization and soldering process for the effective thermal management of the high-power LED systems. By using a simulation model, the thermal distribution and the resultant decrease in temperatures for varying forward electrical currents in high-power LEDs by design optimization is demonstrated. In addition, the optimization of solder process with respect to solder profile in context of vacuum vapor-phase soldering for void-free solder connections is discussed.
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