Design and research of integrated components for microsatellite thermal control system

Abstract

With the increasing development of aerospace technology, micro satellites have attracted high attention in the aerospace field due to their advantages such as short development cycle, low system investment, and flexible launch methods. Their high level of internal equipment integration, high heat flux density, complex and uncertain working modes pose new challenges to thermal control design. At present, the thermal control design of micro satellites still mainly adopts passive methods, while active thermal control design has been widely used in the fluid circuit of large spacecraft, mostly in the “task oriented design mode”. Its high design cost, long cycle, poor adaptability and other characteristics cannot be applied to low cost, short cycle, and flexible launch methods of micro satellites. In response to the new problems brought by the high power density and low thermal inertia of microsatellites in thermal control design, this paper proposes an active thermal control fluid loop system suitable for microsatellites. In addition to the cold plate and radiator at the equipment end, other equipment forms an integrated component in the form of a shared substrate. The integrated component has the characteristics of miniaturization, lightweight, and rapid replacement of board and card. Through simulation and technical analysis of key components, We believe that this scheme is reasonable and feasible, providing a new design scheme for the thermal control design of subsequent micro satellites.