Abstract
This paper introduces a design scheme and key technology of a multi-channel tile-type T/R module. In order to meet the requirements of high reliability, miniaturization, lightweight and multi-functional integration, a vertical interconnection design method of high integrated multi-channel tile-type T / R module is proposed. LTCC technology is used to achieve high-density stacking of radio frequency devices, while bare chips are used to improve system integration and reliability. The module integrates 4 isolated transceiver channels with a size of 40mm×40mm×10mm, which significantly reduces the volume and weight compared to the traditional T/R module structure. The module simulation results prove that the design scheme is easy to implement and fault location maintenance, and the test results meet the design indicators.
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