Abstract

In this paper, a new type of ultrasonic vibration de-gluing device has been designed to remove the cured epoxy resin adhesive that overflowed from the aluminum alloy structural parts in the high-speed train carriages. At present, manual removal is used to remove the cured epoxy resin adhesive that overflows at the bonding site. This method has low removal efficiency and leads to poor surface quality of the parts. The new type of ultrasonic vibration de-gluing device can solve these problems. Modal analysis and harmonic response analysis are carried out on the ultrasonic vibration oscillator system in the ultrasonic vibration de-gluing device, and the reasonable structure parameters and resonance frequency of the ultrasonic vibration oscillator system are determined. Finally, the impedance test and de-gluing effect test are carried out on the prototype of the ultrasonic vibration de-gluing device to verify the feasibility and practicability of the new type of ultrasonic vibration de-gluing device. The results show that the ultrasonic vibration de-gluing device’s stable resonant operating frequency is 28,270 Hz, and the average error between the simulation and experimental results of the resonant operating frequency is less than 3%, which validates the simulation model.

Highlights

  • Some of the aluminum alloy structures in the high-speed train carriages need to be bonded with epoxy resin adhesive

  • The results show that the ultrasonic vibration de-gluing device’s stable resonant operating frequency is 28,270 Hz, and the average error between the simulation and experimental results of the resonant operating frequency is less than 3%, which validates the simulation model

  • Since the finite element analysis has fully validated the theoretical feasibility of the ultrasonic vibration oscillator system in the ultrasonic vibration de-gluing device, the prototype of the ultrasonic vibration de-gluing device was manufactured for experiments, which can verify its practical feasibility

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Summary

Introduction

Some of the aluminum alloy structures in the high-speed train carriages need to be bonded with epoxy resin adhesive. The thickness of epoxy resin adhesive removal is usually below 0.1 mm, which is much lower than the thickness of cured epoxy resin adhesive overflowing from aluminum alloy structural parts in high-speed train carriages. A set of ultrasonic vibration de-gluing devices was developed to remove the cured epoxy resin adhesive that overflowed from the aluminum alloy structural parts after bonding. Compared with the traditional manual removal and laser cleaning technology, the ultrasonic vibration de-gluing device can achieve a balance of processing speed and precision, improving the removal efficiency and quality. When the cutter head comes into contact with the overflowing epoxy resin adhesive, the cured epoxy resin adhesive will be broken into powder by high-frequency vibration, which can be removed. Finite Element Analysis of the Ultrasonic Vibration Oscillator System in the Ultrasonic Vibration De-Gluing Device

Model Analysis of the Ultrasonic Vibration Oscillator System
Harmonic Response Analysis of the Ultrasonic Vibration Oscillator System
Impedance Test Experiment of Ultrasonic Vibration Glue Removal Device
Test of the Ultrasonic Vibration De-Gluing Device
Findings
Conclusions
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