Abstract

Article propose a design for an L-band multi-layer MEMS cross-finger filter based on pore interior wall sputtering. Article analyze the structural parameters, such as resonator thickness and TSV structure, using HFSS simulation software. Findings indicate that the filter has a central frequency of 1.5 GHz, a bandwidth of 140 MHz, a band loss of less than 1 dB, return loss is greater than 25 dB, and a band group delay of less than 800 ps. Furthermore, Article conduct process design optimization and finished product testing for the filter, including optimizing the TSV process for the hole inner wall sputtering process. These results demonstrate the filter's broad application prospects.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.