Abstract

In this paper we review the mechanical properties and reliability results of stretchable interconnections used for electronic applications. These interconnections were produced by a Moulded Interconnect Device (MID) technology in which a specially designed metal interconnection if fully embedded with an elastic material such as polyurethane or silicone. In order to get a first impression of the expected damage in the interconnections, this research employs Finite Element Modelling (FEM) to analyse the physical behaviour of stretchable interconnects under different loading conditions. Moreover, the fatigue life of a copper interconnect embedded into a silicone matrix has been evaluated using the Coffin-Manson relation and FEM.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.