Design and Performance Analysis of Negative Capacitance Effect in the Charge Plasma-Based Junction-Less Vertical TFET Structure

Abstract

In this paper, a negative capacitance (NC) effect in series with normal oxide capacitance is first time introduced to design negative capacitance charge plasma-based junction less vertical TFET structure (NC-CP-JL-VTFET). The introduced negative capacitance enhances the overall gate capacitance and hence gate capacitive coupling and thus renders high current capabilities with reduced sub-threshold slope and threshold voltage. With the use of negative capacitance along with oxide capacitance, it has been seen that the same drain current is achieved at lower gate voltage as compared to without use of negative capacitance and since the voltage scaling is done considerably, the dynamic power dissipation in circuit application can be reduced significantly. To generate the negative capacitance during the device operation; ferroelectric material [Formula: see text](VDF-TrFE) poly(vinylidene fluoride-trifluoro ethylene) is used in stack with SiO2 gate oxide. Various performance parameters of the designed structure such as electron–hole concentration in the tunneling junction, electric field, surface potential, electron–hole quasi-Fermi variation, and drain current variation are investigated and compared with the results of without considering the ferroelectric material in the gate oxide. The variation of the ferroelectric thickness on the device performance is also investigated. The investigation exhibits significant improvement in the drain current and in the other parameters as well. These improvements are seen because of higher capacitive coupling and these effects are further responsible for more energy band bending which in turn govern high electron tunneling. Due to the existence of negative capacitance, the peak value of the electric field gets doubled while the surface potential increases 44% from the normal structure.