Abstract
To realize high-bandwidth interconnection between the optical module and ASIC and to make the CPU maximize its performance, an optical transmission system which is equipped with 192channels running at 56Gbps/ch with PAM4 signals is designed and proposed in this article. In this transmission system, 4 optical transceivers and an ASIC chip are co-packaged in the ceramic substrate. The optical transceiver adopts the 2.5D packaging structure. To ensure the normal operation of the whole optical system, the electrical performance of the transmission are carefully evaluated and the advice to the layout of the optical chip is proposed. Besides, thermal management of the optical system is evaluated and optimized from the heat-dissipation structure. Ultimately, the temperature of all the chips in the optical system are controlled under 105□. After assessing the electrical and the thermal performance of the optical system, the packaging scheme is a potential method manner to reach the high-bandwidth and high-density interconnection.
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