Design and Optimization of Temperature Sensor Based On LGA Package Structure

Abstract

With the rapid development of wearable devices, the IC temperature sensors which used LGA Package have been widely used to meet the needs of product miniaturization. There are three heat conduction modes in LGA package: heat conduction, air convection and radiation, and thermal conductivity directly affects the temperature sensor's induction speed and measurement accuracy. This paper mainly introduces the heat conduction structure, heat transfer mechanism and thermal resistance calculation method of temperature sensor based on LGA package; the finite element analysis software used to model the structure of the IC temperature sensor module, and simulates the thermal resistance value and temperature rise. By analyzing the heat conduction between the inner structures of the packaging module, the thermal conductivity structure of the module is optimized, to improve the induction speed and measurement accuracy of the IC temperature sensor. By replacing part of the resin material with stainless steel, increasing the thermal conductivity area of the stainless steel material and sticking the temperature sensor chip on the stainless steel, the design and optimization of the thermal conductivity effect were carried out. The simulation analysis showed that the third thermal conductivity effect was the best.