Abstract
The popularity of electronic devices used in a wide range of applications has significantly increased over recent years. As a result, more and more power packages are needed. Plastic packages have many problems in preserving and long-time employing. Unlike conventional power package, a ceramic power package is designed and investigated in this paper. Finite element simulation is applied to help package design. On the basis of high temperature co-fired ceramic technique, packages are fabricated. Several kinds of reliability test are carried out. Moreover, the mechanism of crack initiation and propagation in the outer leads of invalid sample are also discussed. Experiment results showed that cracks on the surfaces of standard outer leads were initiated under stress, and propagated along the direction of crystal boundaries. After optimizing the structure of outer leads, all packages have passed reliability test successfully. This investigation would enlarge the way for power package in application by improving its reliability in harsh environment.
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