Design and Implementation of Automatic Cooling Case Based on High-Power and High-Density Power Supply Array

Abstract

Multi-board electronic cases with high-density and power modules are widely used in industrial power supply management. Heat dissipation becomes an important factor in the design process in improving case performance and miniaturization requirements. The design of existing small electronic thermal methods ignores high-temperature and high-load environment tests without automation control. To solve these problems, a heat dissipation case is designed with a magnesium and aluminum alloy, for intelligent temperature control based on a high-power and high-density power supply array. Based on the extreme miniaturization design principle, a composite heat dissipation mode is adopted based on conduction and supplemented by forced air cooling. The results show that the heat dissipation design in this article can work normally in high-temperature and high-load environment tests. Finally, the existing cooling designs are compared and analyzed. The cooling performance parameters in this article are better than those in the existing case. It contributes to the thermal design of miniaturized electronic cases in power supply management.