Abstract

Due to the recent semiconductor yield issue, the proportion of the MI (Measurement, Inspection) process in the semiconductor industry is rapidly growing. Mass production of one wafer takes enormous cost and time, and due to the nature of wafers, defective wafers cannot be reused, which causes enormous losses. In this study, we propose an inspection method system using an ellipsometer for the wafer MI process. It is expected that cost reduction in semiconductor production can be achieved by making wafer defect inspection more efficient.

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