Abstract
The air-based 1-3 piezoelectric composite transducers are designed and fabricated in order to solve the acoustic impedance matching problem. Firstly, a finite element model using honeycomb structure as the piezoelectric composite matrix is built to reduce the acoustic impedance of the sensitive element. Three important factors, volume fraction of piezoelectric materialsφ, the thicknessh, and the sizesof the square cross section of piezoelectric column, are examined and verified in simulation. Then, according to the result of simulation, the piezoelectric composites and the air-coupled transducers are fabricated. The honeycomb structures of resin are produced by the method of 3D printing technology, with the volume fraction of air being 30%. The impedance characteristics and the excitation/reception performance of the air-coupled transducers are measured and optimized. Meanwhile, a scanning experiment is carried out to demonstrate the crack detection process in monocrystalline silicon.A0mode of Lamb waves is excited and collected. The location and size of the defect will be determined by calculating the correlation coefficients of the received signals and reference signals. Finally, a 15 mm × 0.5 mm × 0.5 mm scratch is clearly distinguished.
Highlights
Silicon is one of the most important components of solar cells, and the original integrality of silicon wafer affects the photoelectric conversion efficiency and service life significantly
The damage detection for silicon wafer is mainly classified into several methods, which include resonance ultrasonic vibrations [1] and ultrasonic guided waves [2]
All of the results show that the correlation coefficients of the received signals at defective position are lower, which means the waveforms have been distorted when Lamb wave travels across the defect
Summary
Silicon is one of the most important components of solar cells, and the original integrality of silicon wafer affects the photoelectric conversion efficiency and service life significantly. A suitable nondestructive testing and evaluation method should be performed to inspect the cracks in silicon wafer. The damage detection for silicon wafer is mainly classified into several methods, which include resonance ultrasonic vibrations [1] and ultrasonic guided waves [2]. With the increasing demand for highspeed inspection, nondestructive inspection modes using ultrasonic guided waves have become a research hotspot. The nondestructive inspection modes can be broadly divided into contact methods and noncontact methods. The methods of noncontact ultrasonic testing are mainly aircoupled ultrasonic testing [3], laser ultrasonic testing [4], and electromagnetic ultrasonic testing [5]
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