Design and fabrication of a ceramic land grid array package for power supply circuits

Abstract

The popularity of electronic devices used in a wide variety of applications have significantly increased, as a result, more and more power supplies are needed urgently. In this paper, a ceramic land grid array package for power supply circuits is designed. Unlike conventional low temperature co-fired ceramic and plastic power supply packages, which exhibited many problems in deposit and long-time employment, a structure with superior properties using materials of alumina ceramic and tungsten is proposed. Theoretical analysis, finite element simulation and experimental research are applied to help package design. On the basis of high temperature co-fired ceramic technique, package specimens are also fabricated. Finally, several kinds of tests, including conductivity resistance, current carrying capability, temperature cycling test and gas leakage are carried out to evaluate the performance and reliability of packages. Experiment results indicate that all packages are qualified. Our fabricated packages are able to support 10 A load without experiencing property damage or deterioration. After temperature cycling within -65 °C ∼ +125 °C, 100 heating-cooling cycles, subsequently, the gas leak rates of all specimens are detected with values are not higher than 1 × 10−3 Pa·cm3/s. Moreover, there is no appearance quality defect can be observed by 20 × microscopy at the end of tests. Performance and reliability of the fabricated package samples meet requirements set out in the application.