Abstract
1.25 Gb/s optoelectronic full-triplex transceiver module with planar-lightwave-circuits was designed and fabricated for the fiber-to-the-home services according to G/E-PONs standards. A low electrical crosstalk of the critical characteristics for the reliable operation of the 1.25 Gb/s full-triplex transceiver module is intensively investigated because the electrical crosstalk on a resistive silicon substrate is more serious than that on a dielectric substrate. It is observed that the performances of the transmitter and receiver satisfy the transmitter and receiver specifications defined in the standards. From this proposed module layout, a design convenience as well as a great reduction of the silicon substrate size by about 50% was completely achieved. Consequently, the 1.25 Gb/s full-triplex transceiver module was fabricated with electrical and mechanical packaging technologies such of a low crosstalk design and a passive alignment method.
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