Design and experiments of a patch antenna on a thick resin layer fed through a hole in a silicon chip in the 60GHz band

Abstract

We proposed a patch antenna placed on a thick resin layer on the opposite side of a CMOS RF circuit in a silicon chip and fed through a hole with coaxial-line structure in the 60GHz band. The thick resin layer of 200 μm thickness can enhance the radiation efficiency. The connection loss between the antenna and the RF circuit is expected to be small. In this paper, we design and fabricate a patch antenna over a 5 mm square silicon chip. The simulated connection loss is 0.2 dB, and the radiation efficiency including the connection loss is 76.4%. The measured radiation efficiency of 73.6-75.3% is achieved using a reverberation chamber.