Design and experimental study on a new heat dissipation method for watch-phones

Abstract

In this work, a new heat dissipation method based on ultra-thin flattened heat pipe (UTHP) is developed for cooling watch-phones. The UTHP with a 0.4 mm thickness was designed to be a three-dimensional shape according to the watchcase shape. The UTHP cooling module (HPM) was soldered by three copper plates and a UTHP. The heat dissipation performance of the copper sheet cooling module (CSM) with the same dimensions was made for comparison with the HPM. The heat dissipation performance of the HPM was experimentally studied. The results indicate that the maximum heat dissipation powers of CSM and HPM were 0.8 and 0.9 W, respectively, at the surface temperature of the ceramic heater not exceeding 65 °C. At this time, ΔTc and Rhc of them were 9.18 °C and 9.86 °C/W, 3.98 °C and 2.63 °C/W, respectively. When the cooling module was cooled naturally from 65 to 37 °C, the heat dissipation time of HPM was 25 s shorter than that of CSM. The UTHP cooling module has a better heat dissipation performance, which can quickly reduce the chip temperature, eliminate the chip hotspot, and solve the heat dissipation issue of watch-phone.