Design and demonstration of an ultra-thin planar microscale capillary pumped loop for electronics thermal management

Abstract

With new requirements for enhanced thermal management, the minimum size of modern compact electronic devices and the maximum allowable processing speeds of the underlying microprocessor chips have become fundamentally limited by Joule heating. Miniaturizing a conventional loop heat pipe (LHP) or capillary pumped loop (CPL) to enable an ultra-thin high-heat-flux thermal transport system can lead to a paradigm shift in electronics thermal management. However, the complex thermodynamics of a CPL flow loop and the altered behavior of surface tension forces and thermal transport effects at small length scales pose several challenges to the actual implementation of a planar microscale CPL. Here we report on the design aspects of a micro-CPL device fabricated on a 500μm-thick silicon wafer, and experimentally examine the process of evaporation and two-phase flow in the device. An optical study of liquid evaporation in two distinct planar evaporator topologies during device startup reveals the critical roles played by enhanced surface tension forces and increased parasitic heat flows. Critical microfluidic device design aspects that can ensure the successful startup and operation of these ultra-thin thermal management devices are thereby revealed. Device evaporation experiments reveal successful device startup under evaporative heat fluxes of 10–20 W/cm2.