Abstract

This paper presents a process of development, construction, and testing of the system designed to control the thermal relaxation process in liquid metal bath. The task was to use microprocessor-based system to measure and control the heating process in the solder melting pot. This would allow precise control and measurement of temperature in liquid metal bath. Additionally, we discuss the benefits and shortcomings of choosing a liquid metal bath for thermal relaxation and shortly analyze the results of annealing on samples tested.

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