Abstract
This paper presents a novel concept for the co-design of microwave heaters and microfluidic channels for sub-microliter volumes in continuous flow microfluidics. Based on the novel co-design concept, two types of heaters are presented, co-designed and manufactured in high-resistivity silicon-glass technology, resulting in a building block for consumable and mass-producible micro total analysis systems. Resonant and non-resonant co-planar waveguide transmission line heaters are investigated for heating of sub-micro-liter liquid volumes in a channel section at 25 GHz. The heating rates of 16 and 24 °C/s are obtained with power levels of 32 dBm for the through line and the open-ended line microwave heater, respectively. The heating uniformity of developed devices is evaluated with a Rhodamine B and deionized water mixture on a micrometer scale using the microwave-optical measurement setup. Measurement results showed a good agreement with simulations and demonstrated the potential of microwave heating for microfluidics.
Highlights
This paper presents a novel concept for the co-design of microwave heaters and microfluidic channels for sub-microliter volumes in continuous flow microfluidics
According to the microwave design in COMSOL Multiphysics, the open-ended line microwave heater (OELMH) dissipates more power in the microfluidic channel than the through line microwave heater (TLMH), which is confirmed by microwave
According to the microwave design in COMSOL Multiphysics, the OELMH dissipates more power in the microfluidic channel than the TLMH, which is confirmed by microwave measurements—the TLMH dissipates 37% of the input power, while the OELMH dissipates 51%
Summary
Liquid filtering and particle separation are achieved using microfluidic filters with an array of pillars [2], while signal detection to evaluate reactions is done using optical [3] or electrical devices [4,5,6]. Temperature control is achieved utilizing contact-based heating devices [7]. The traditional heaters perform adequately if thermal runaway to the whole fluidic device is not a limiting factor, and the substrate material of the fluidic chip can conduct heat sufficiently well. If one of these two factors cannot be respected, a different heating technique is required
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