Abstract
A three-dimensional packaging technology based on stacked multi-layer aluminum nitride (AlN) multichip modules (MCMs) has been demonstrated by Honeywell and Coors Electronic Package Company, under sponsorship of the Naval Command, Control and Ocean Surveillance Center. The concept increases chip density by stacking single-or double-sided AlN MCMs that have internal metal layers for signal interconnection and power distribution. Prototype Technology Characterization Vehicles (TCVs) have been fabricated to verify key fabrication and assembly processes, and to characterize the electrical, thermal, and mechanical performance of the 3D structures. Exceptional thermal performance has been predicted by finite element models and corroborated by experimental measurements for single and stacked MCMs. The electrical characteristics of AlN interconnections for the TCV are also discussed. A demonstration system consisting of a GVSC 1750A processor MCM and a double-sided memory MCM has been designed and fabricated. A prototype of the demonstration system is shown.
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