Design and characterization of a hybrid-integrated MEMS scanning grating spectrometer

Abstract

Grating spectrometer, like the well-established Czerny-Turner, are based on an optical design consisting of several components. Typically at least two slits, two mirrors, the grating stage and a detector are required. There has been much work to reduce this effort, setups using only one mirror (Ebert - Fastie) or the replacement of the entrance slit through the use of thin optical fibers as well as integrated electronic detector arrays instead of a moving grating and an exit slit and single detector device have been applied. Reduced effort comes along with performance limitations: Either the optical resolution or throughput is affected or the use of the system is limited to the availability of detectors arrays with reasonable price. Components in micro opto electro mechanical systems (MOEMS-) technology and spectroscopic systems based thereon have been developed to improve this situation. Miniaturized scanning gratings fabricated on bonded silicon on insulator (BSOI-) wafers were used to design grating spectrometer for the near infrared requiring single detectors only. Discrete components offer flexibility but also need for adjustment of two mirrors, grating stage, fiber mount and the detector with its slit and optionally a second slit in the entrance area. Further development leads towards the integration of the slits into the MOEMS chip, thus less effort for adjustment. Flexibility might be reduced as adjustments of the optical design or grating spacing would require a new chip with own set of masks. Nevertheless if extreme miniaturization is desired this approach seems to be promising. Besides this, high volume production might be able for a comparable low price. A new chip was developed offering grating, two slits and a cavity for the detector chip. The optical design was adjusted to a planar arrangement of grating and slits. A detector buried in a chip cavity required a new mounting strategy. Other optical components were optimized and fabricated then the systems was assembled with electronics and software adjusted to the new design including some new features like integrated position sensors. A first test of systems to grant function of all components is presented. Further work will be aimed at improved performance like higher resolution and lower SNR.