Design and application of thin, planar magnetic components for embedded passives integrated circuits

Abstract

The integration of passive components into the printed circuit board (PCB) as embedded passives integrated circuits (emPIC) results in a higher power density of power converters. To achieve a highly automated, low cost, integral manufacturing, the devices are constructed layerwise. Especially for magnetic components like inductors and transformers the design of such thin components is challenge. Because of the high aspect ratio, traditionally used models lead to a high calculation effort or use non-appropriate neglecting. This publication presents an analytic approach for such a calculation. The model considers the magnetic flux distribution in the core and in the winding area and therefore allows a precise calculation of the inductivity as well as the losses in the device and their distribution. It is very well suited for a parametric analysis and thus for the synthesis of thin planar magnetic components. The assumptions and the results of the model match well to measurements on real samples. With the help of this model a 60 W off-line converter was designed and fabricated. Its transformer is entirely integrated in the PCB as well as 11 capacitors. Standard PCB lamination processes are used for the layerwise integration of the components. The circuit needs an area of the size of a credit card with a PCB thickness of 4 mm. Up to 82% efficiency could be achieved.