Design and analysis of ultra-wideband miniaturized metamaterial absorbers for radiation suppression

Abstract

This paper presents a novel miniaturized ultra-wideband metamaterial absorber with a thickness of 0.069λ L thick, engineered to suppress electromagnetic radiation in high-frequency chip packaging. The absorber’s bandwidth is enhanced through the incorporation of lumped resistors and patterned metal strips. Simulation results reveal an absorption efficiency exceeding 90% across the frequency range of 17.3–33.5 GHz, while maintaining polarization insensitivity and angular stability. The absorption mechanism is investigated using equivalent circuit theory and the S-parameter inversion method, which demonstrate consistent impedance matching and advantageous loss characteristics throughout the wide band. Relevant objects were meticulously prepared and tested, yielding a high correlation between the measured and simulated results. The proposed absorber, when integrated into package chips and patch antennas, significantly reduces the far-field electric field amplitude in both applications. Specifically, the packaged chip shows up to 19.7 dB of electromagnetic radiation suppression and the patch antenna structure achieves over 10 dB of radiation suppression in the 24.2 GHz–30.4 GHz range post-integration. These results affirm the absorber’s efficacy in effectively reducing unwanted electromagnetic radiation in specified frequency bands within complex electromagnetic environments. The absorber’s demonstrated effectiveness provides a promising approach to address the increasing issue of electromagnetic radiation in progressively miniaturized electronic devices.