Abstract

A structure of micro-electro-mechanical system (MEMS) linear phased array based on “multi-cell” element is designed to increase radiation sound pressure of transducer working in bending vibration mode at high frequency. In order to more accurately predict the resonant frequency of an element, the theoretical analysis of the dynamic equation of a fixed rectangular composite plate and finite element method simulation are adopted. The effects of the parameters both in the lateral and elevation direction on the three-dimensional beam directivity characteristics are comprehensively analyzed. The key parameters in the analysis include the “cell” number of element, “cell” size, “inter-cell” spacing and the number of elements, element width. The simulation results show that optimizing the linear array parameters both in the lateral and elevation direction can greatly improve the three-dimensional beam focusing for MEMS linear phased array, which is obviously different from the traditional linear array.

Highlights

  • Ultrasonic transducers and their array have an important application on non-destructive testing and medical acoustic imaging

  • The high frequency micro-electro-mechanical system (MEMS) transducers with good resolution are easier to achieve than those prepared by traditional fabrication technologies, and the vibration of MEMS piezoelectric transducer is mostly a bending vibration with the advantages of high sensitivity, wide bandwidth, flexible design, etc

  • In bending vibration mode at high frequency, the structure based on element is designed

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Summary

Introduction

Ultrasonic transducers and their array have an important application on non-destructive testing and medical acoustic imaging. Compared with current transducers, based on lead zirconate titanate (PbZrx Ti1 ́x O3 , PZT) bulk materials, piezoelectric micro-machined ultrasonic transducer (pMUT) fabricated by piezoelectric film deposition and micro-electro-mechanical system (MEMS). The technical challenge of three-dimensional acoustic imaging is the fabrication of two-dimensional array transducers with many elements, high element density and small element size. Lapping and dicing bulk materials will become more difficult with traditional technologies of transducer fabrication. The high frequency MEMS transducers with good resolution are easier to achieve than those prepared by traditional fabrication technologies, and the vibration of MEMS piezoelectric transducer is mostly a bending vibration with the advantages of high sensitivity, wide bandwidth, flexible design, etc. As an important pMUT array, a MEMS linear phased array has been developed [2,3,4,5]

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