Abstract

High static power associated with static random access memory (SRAM) represents a bottleneck in increasing the amount of on-chip memory. Novel, emerging nonvolatile memories such as spin-transfer torque magnetic random access memory (STT-RAM), resistive random access memory (RRAM), and ferroelectric field effect transistor-based random access memory (FeFET-RAM) are alternatives for replacing hardware kernels such as SRAM-based last level caches (LLC) due to their fast access times and lower leakage. In this paper, we study an ultra-dense FeFET-RAM based on 1-FeFET memory cells, and address potential disturbance issues at the array level. Disturbances are studied experimentally and via simulation. Experimental measurements are well correlated with modeling results suggesting that we have a good understanding of how disturbance issues will manifest themselves. That said, previous WRITE schemes for 1-FeFET arrays may: 1) exacerbate disturbances and 2) significantly degrade figures of merit (FoM) such as WRITE power. To address these issues, we propose the use of columnwise body connections to simultaneously overcome disturbances and reduce leakage currents during WRITES. We present detailed studies on how 1-FeFET memory cells and arrays (with columnwise body bias) fare when compared to traditional SRAM approaches and other emerging technologies. Notably, we benchmark the 1-FeFET memory against 1T * 1FeFET and 2T * 1FeFET designs proposed in early works, as well as SRAM, STT-RAM, and RRAM. Our evaluation of a $64\times 64$ FeFET-RAM array shows that the area, READ delay, and static power are reduced by $\sim 5.3\times $ , $\sim 1.5\times $ , and $\sim 74\times $ , respectively, when compared to an SRAM equivalent. Also, the 1-FeFET memory cell design shows $\sim 50\times $ improvements in terms of WRITE energy with respect to STT-RAM and RRAM counterparts.

Highlights

  • In state-of-the-art processors, cache structures are typically comprised of complementary metal–oxide–semiconductor (CMOS) static random access memory (SRAM) cells

  • Nonvolatile memories based on emerging technologies such as spin-transfer torque magnetic random access memory (STT-RAM), resistive random access memory (RRAM), and phase-change memory (PCM) have

  • WRITE DISTURBANCES WRITE disturbances—where a bit stored in a memory cell is changed as other bits are written—are a well-studied issue that could occur in memory arrays comprised of many different technologies, including SRAM, STT-RAM, and RRAM

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Summary

INTRODUCTION

In state-of-the-art processors, cache structures are typically comprised of complementary metal–oxide–semiconductor (CMOS) static random access memory (SRAM) cells. To combat these challenges, we propose a columnwise body connection that: 1) can solve the aforementioned (and severe) disturbance problems associated with previous ±(VW /2) and ±(VW /3) WRITE schemes and 2) reduce leakage currents during the WRITE operation by ensuring Vb = Vs = Vd in all unselected cells in every column. WRITE energy and leakage power is reduced by ∼50× and ∼74× when compared to STT-RAM/RRAM and SRAM, which makes 1-FeFET-based FeFET-RAMs promising candidates for the design of last level caches (LLCs) that demand high speed, high density, and low leakage

BACKGROUND
RELATED WORK
ARRAYS BASED ON 1-FeFET MEMORY CELLS
VARIABILITY
WRITE DISTURBANCE IN 1-FeFET MEMORY ARRAYS
BENCHMARKING
MEMORY CELLS OF VARIOUS TECHNOLOGIES
CONCLUSION
Full Text
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